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  • 06 May 2022

    Sr Packaging Engineer - Die bond/Die attach

    Taiwan Region

    Permanent Position
    Leading IDM

    Job Description

    • Develop new package requirements and maintaining quality of existing packages for all product groups

    • Define package requirements for product groups and customer requirements

    • Develop new package and process qualification programs.

    • Perform integrity analysis of packages utilizing appropriate tools

    • Perform package characterizations including cost effectiveness studies.

    • Maintain product quality while developing and introducing package cost reduction programs

    • Coordinate the introduction of new package processes into production

    Expires on 30 Jun 2022

    Posted By

    Christine Huang

    Tel: +886 986 310 855


    • Master degree in Mechanical Engineering, Material Science or related fields

    • 3~10 years in assembly engineering field with die attach process hands on experiences

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